Global Electronic Adhesives Market to 2027


According to the publisher, the global Electronic Adhesives market is expected to witness a significant growth rate during the forecasted period.

Companies Mentioned: Henkel AG & Co. KGaA, The Dow Chemical Company,, H.B. Fuller Company, The 3M Company, BASF SE,Alent plc, KYOCERA Chemical Corporation, Hitachi Chemical co. Ltd., LG Chem Ltd., Indium Corporation, Mitsui Chemicals, Sika AG, Pidilite Industries Ltd., Permabond LLC, MAPEI S.p.A.

Factors like surface mount technology extensively use electronics adhesives in electronics assembling to mount electronic parts to the upper layer of the printed circuit board are expected to drive the Electronic Adhesives market growth. Further, the demand for Electronic Adhesives is increasing in the automotive industry due to the rapid use of electronic components in numerous automotive parts.

Furthermore, the technological innovations and advances in end-user sectors fuel the demand for Electronic Adhesives, thereby raising the growth of the Electronic Adhesives market. However, substantial installation costs involved in product assembly and lamination & packaging of advanced machinery are hampering the development of the electronic adhesive market. The matured market for electronic adhesives in developed countries and fluctuations in currency exchange rates are expected to hinder the market’s growth.

Electronic Adhesives are mainly used in wire tacking, binding the surface-mount components, & encapsulating components. Electronic Adhesives finds applications in various end-use applications such as mobiles & telecommunications, desktops, networks, televisions, home appliances, automotive electronics, aerospace & defense, analytical & measurement instruments, & medical equipment.

Surface mounting, also called chip bonding, is the primary application of adhesives in the electronics industry. Electronic sealants are applied for both wave soldering and reflow soldering processes, and these compounds have superior electrical conductivity and are easy to distribute. The method includes placing surface mount devices on beads or dots of UV curing adhesives and curing the adhesive to firmly, securely hold the device at the requisite place during further processing of the manufactured electronic equipment. Surface mounting adhesives perform as a processing aid by having the mount devices until permanent attachment by soldering and offering stress relief to soldering parts to prevent failure of electric connections.

The properties of Electronic Adhesives required for surface mounting are long shelf life, non-stringing, rapid curing, high strength and good flexibility, and electrical properties after curing. Single-component systems are preferred for these applications to avoid air entrapment, viscosity changes, and pot life. The function of these Electronics Adhesives also varies depending on the application, and they can either be electrically conductive or electrically non-conductive and thermally conductive. The growing research in developing high-performance adhesives for mounting miniaturized devices in the electronics industry is estimated to increase the market growth during the forecast period.

The Asia-Pacific accounted for the highest share of the market and is likely to continue dominating the Electronic Adhesives market during the forecasted period. The increasing demand for safety features, comfort, stability, and high performance is driving the need for electrification in automobiles, fueling electronic adhesives. Besides semiconductor applications in automotive, thermally conductive adhesives are the most popular in automotive electronics, wherein they are used for attachment and thermal management. The emerging trends of lightweight electronic products and vehicles are boosting the demand for cyanoacrylate electronic adhesives.

Advances in complex automobile designs with various lightweight substrates and innovative self-adhesive labels and packaging are expected to drive the need for more convenient application systems. Advancement in technology coupled with the implementation of safety regulations for electronic applications is anticipated to drive the development of the electronic adhesives market soon. The performance of new solid-state semiconductor technologies in industrial and consumers applications is probably to speed up the extension of the market. Companies are investing more in the use of microelectronic devices in niche applications. This is expected to propel the growth of the Electronic Adhesives market.

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